Wuhan Dike Surface Technology CO., Ltd

Wuhan Dike Surface Technology CO., Ltd

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copper electroplating copper brightener solution copper electroplating solution

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Wuhan Dike Surface Technology CO., Ltd
City:wuhan
Province/State:hubei
Country/Region:china
Contact Person:MrsDeng
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copper electroplating copper brightener solution copper electroplating solution

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Brand Name :Dike
Model Number :LP
Place of Origin :China
MOQ :Negotiable
Price :Negotiable
Payment Terms :L/C, T/T, Western Union, MoneyGram
Supply Ability :20 tons/month
Packaging Details :25KG/DRUM
Chemical name :LP
Appearance :Colorless to yellowish liquid
Purity :50%
Usage :Grain refining agent, brightener
Characteristics :High purity,high-stability, can be used for longer time
Concentration in the bath :60-200mg/L
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Product Description

Chemical Name: Polyether

Application

Usage: Grain refining agent, brightener
Characteristics: High purity,high-stability, can be used for longer time.

Concentration in the bath 60-200mg/L

Chemical nature

Product Acid Copper Plating Chemicals
Appearance Colorless to yellowish liquid
Purity 50%
Usage Grain refining agent, brightener
Characteristic High purity,high-stability, can be used for longer time

The electroplating copper solution mainly includes three main steps: pretreatment, electroplating operation and post-treatment. ‌

Pretreatment
The purpose of pretreatment is to remove pollutants such as grease, dust, oxides, etc. on the surface of the substrate to ensure the adhesion and uniformity of the coating. The specific steps are as follows:

‌Cleaning and degreasing‌: Use solvent cleaning, alkaline cleaning or electrolytic degreasing to remove grease and dirt on the surface of the substrate.
‌Pickling and passivation‌: Use acidic solution to remove surface oxides, and passivate after pickling to form a protective layer to prevent re-oxidation.
‌Activation treatment‌: Remove residual oxides and pollutants through dilute acid treatment to ensure that the surface of the substrate is completely clean and activated.

Electroplating operation
The preparation of the plating solution and the configuration of the electrode are the key to the electroplating operation. The specific steps are as follows:

‌Preparation of plating solution‌: The plating solution is composed of main salt, auxiliary salt, buffer and brightener, etc. The concentration and proportion of each component must be strictly controlled during preparation.
‌Electrode configuration‌: The anode is generally the metal to be plated, and the cathode is the substrate to be plated. The configuration needs to ensure uniform distribution of the electric field to avoid excessive or too small local current.
‌Current and voltage control‌: According to the characteristics of the substrate and the plating solution, the current density and voltage are reasonably selected to ensure uniform deposition of metal ions.

Post-treatment
Post-treatment aims to improve the quality and appearance of the coating. The specific steps are as follows:

‌Cleaning‌: Use running water to thoroughly clean the plated parts to remove electrolyte residues.
‌Drying‌: Remove surface moisture to ensure that the coating is dry.
‌Polishing and brightening‌: Improve the brightness and smoothness of the coating and ensure surface quality.
‌Quality inspection‌: Ensure that the coating meets the standards and requirements through methods such as appearance inspection, thickness measurement and corrosion resistance testing.
Through the above steps, the solution for electroplating copper can be effectively implemented to ensure the quality and performance of the coating.

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